Members' list of Industrial Diamond Association of Japan
（
Alphabetical Order
）
(Company names of blue color with underline indicate website holders) ABE DIAMOND CO., LTD 2595-7 Miyadera Iruma-city,Saitama Pref. 358-0014TEL 0429-34-3110 FAX 0429-34-3169 A.L.M.T.Corp.1-11-11, Shiba, Minato-ku,Tokyo 105-0014TEL 03-5418-1801 FAX 03-5418-1810ARAI SHOKAI CO., LTDTsurumi Bldg. 5th Fl.2-1-6 Kitasaiwai, Nishi-ku, Yokohama-shi, Kanagawa Pref. 220-0004TEL 045-410-1233 FAX 045-410-1244 ASAHI DIAMOND INDUSTRIAL CO., LTD Garden Court, 4-1 Kioi-cho,Chiyoda-ku, Tokyo 102-0094 TEL 03-3222-6311 FAX 03-3222-6305 CHIYODA
DIAMOND INDUSTRIAL CO., LTD 2-21-8 Ikegami, Ota-ku,Tokyo 146-0082 TEL 03-3754-4071 FAX 03-3754-4519 CHUO DIAMOND INDUSTRIAL CO., LTD Shinyo Bldg. 2-18-8 Matsunami, Chuo-ku, Chiba-city, Chiba Pref. 260-0044 TEL 043-256-3133 FAX 043-252-8480 CRYSTON DIAMOND INDUSTRIAL CO., LTD 2-28-14 Tamagawa, Ota-ku, Tokyo 146-0095 TEL 03-3759-7405 FAX 03-3759-3166 DAICHI DIA CO., LTD 2-4-1 Kuriki, Asou-ku, Kawasaki-city, Kanagawa Pref. 214-0038 TEL 044-981-1311 FAX 044-981-1052 DAIYA TOOL COMPANY LTD. 4-23-4-203 Takanawa, Minato-ku, To kyo 108-0074 TEL 03-5795-0717 FAX 03-5423-5293 DISCO ABRASIVE SYSTEMS K.K. 2-15 Minami-Shinagawa, 2-Chome Shinagawa-ku, Tokyo 140-0004 TEL 03-5461-7501 FAX 03-5461-7525 ELEMENT SIX LTD.
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th Fl. PMO Hacchobori. 3-22-13, Chuo-ku, Tokyo 104-0032 TEL 03-3523-9311 FAX 03-3523-9315 FSK INC.1Chuden, Shinchi, Chita-city, Aichi Pref. 478-8641TEL 0562-55-3115 FAX 0562-56-0474 FUJI DIA CO., LTD 3-39-1 Chofugaoka, Chofu-city, Tokyo 182-0021 TEL 0424-86-1181 FAX 0424-90-7137 FUJI DIES KOGYO CO., LTD 5-18-2 Nishiawaji, Higashiyodogawa-ku, Osaka-city, Osaka Pref. 533-0031 TEL 06-6322-6131 FAX 06-6323-0841 GLOBAL DIAMOND CO., LTD Akasaka kurokawa Bldg.2F, 2-5-8 Akasaka,Minato-ku, Tokyo 107-0052 TEL 03-3589-0366 FAX 03-3589-0340 GOEI MANUFACTORY CO., LTD 576 Komatsubara, Akitsu-machi, Hiroshima-City, Hiroshima Pref. 739-2405 EL 0846-45-5121 FAX 0846-45-5120 ILJIN JAPAN KK 2-7-7 Shiba Daimon, Minato-ku, Tokyo 105-0012 TEL 03-5405-2820 FAX 03-5405-3577 INTERNATIONAL DIAMOND CO., LTD 1-8-21 Yaguchi, Ota-ku, Tokyo 146-0093 TEL 03-3756-2222 FAX 03-3756-2245 I KEIHIN KOGYOSHO CO., LTD 2-13-8 Higashi-ohi, Shinagawa-ku, Tokyo 140-0011 TEL 03-3761-2131 FAX 03-3761-8240 KITAGAWA
DIAMOND INDUSTRIAL CO., LTD 1-6-1 Kamimaetsu, Naka-ku, Nagoya-city, Aichi Pref. 460-0013 TEL 052-331-1021 FAX 052-332-5135 KYOTO DIAMOND IND. CO., LTD 751 Haikata-cho, Oharano, Nshikyo-ku, Kyoto-city, Kyoto Pref. 610-1132 TEL 075-331-5355 FAX 075-331-7313 MITSUBISHI MATERIALS CORPORATION Powder Metallurgy Products &Tools CompanyDIAMOND TOOLS DEPT. Keidanren-Kaikan Bldg., 1-3-2 Ohtemachi,Chiyoda-ku, Tokyo 100-8117 TEL 03-5252-5424 FAX 03-5252-5436 MITSUI BUSSAN PLASTICS TRADE CO. LTD.ADVANCED MATERIALS BUSINESS UNIT SPECIALITY MATERIAL DIVISION Kayaba First Bldg., 17-21, Shinkawa 1-Chome
Ｃｈｕｏｕ－ｋｕ
, Tokyo 10 4-0033 TEL 03-6328-5290 FAX 03-6328-5419 MUTUAL CORPORATION Osaka JA Bldg. 1-2-5 Nishitenma, Kita-ku, Osaka-city, Osaka Pref. 530-0047 TEL 06-6315-8610 FAX 06-6315-8618 NAGOYA DIAMOND INDUSTRIAL CO., LTD 175-1 Takinishimachi, Komaki-city, Aichi Pref. 485-0054 TEL 0568-72-3614 FAX 0568-75-2950NAIGAI DIAMOND CO., LTD 28 Aza-Kitakasaya, Ooaza-Inuyama, Inuyama-city, Aichi Pref. 484-0081 TEL 0568-61-0404 FAX 0568-61-0487 NANIWA TOISHI CO., LTD 35 Takeda Nanasegawamachi, Fushimi-ku, Kyoto-city, Kyoto Pref. 612-8422TEL 075-641-8377 FAX 075-641-8378 NIPPON DIAMOND CO., LTD 686-1 Saedo-cho, Tsuzuki-ku,Yokohama-city, Kanagawa Pref. 224-0054 TEL 045-939-3000 FAX 045-939-3009 NIPPON VAN MOPPES LTD 13-10 Kita-Shinagawa, Shinagawa-ku, Tokyo 140-0001 TEL 03-5783-4322 FAX 03-5460-0710 NORITAKE SUPER ABRASIVE CO., LTD 210 Takeno, Tanushimaru-cho, Ukiha-gun, Fukuoka Pref. 839-1215 TEL 0943-73-0730 FAX 0943-73-3081 OGURA JEWEL INDUSTRIAL CO., LTD 5-7-12 Ohmorikita, Ota-ku, Tokyo 143-0016 TEL 03-3763-3111 FAX 03-3763-3124 ORIENTAL DIAMOND TOOL LABORATORY LTD2-908-8 Shinmaruko Higashi, Nakahara-ku, Kawasaki-city, Kanagawa Pref. 211-0004 TEL 044-433-7171 FAX 044-41-0201 RIKEN DIAMOND INDUSTRIAL CO., LTD 1-16-14 Higashi-Nippori, Arakawa-ku, Tokyo 116-0002 TEL 03-3805-3471 FAX 03-3805-2434 SAINT-GOBAIN K.K. Diamond Products Division74, Sugaya, Isumi-city, Chiba Pref. 298-0106 TEL 0470-86-3034 FAX 0470-86-2125 SANGYO DIAMOND INDUSTRIAL CO., LTD 4-26-7 Taito, Taito-ku, Tokyo 100-0016 TEL 03-3833-9921 FAX 03-3832-3442 SANKYO DIAMOND INDUSTRIAL CO.,LTD 1770 Hongo, Ebina-city, Kanagawa Pref. 243-0417 TEL 0462-38-6161 FAX 0462-38-6165 SANWA KENMA, LTD 22-1 Uenoyama, Okubo-cho, Uji-city, Kyoto Pref. 611-0033 TEL 0774-41-6126 FAX 0774-44-8860 SEIKEN DIAMOND INDUSTRIAL CO., LTD OK Tsukasa Bldg. 2-21 Kandatsukasa-cho, Chiyoda-ku, Tokyo 101-0048 TEL 03-3293-7221 FAX 03-3292-8425 SHIN-NISSAN DIAMOND TOOL MFG. CO.,LTD 2-30 Torihama-cho, Kanazawa-ku, Yokohama-city, Kanagawa Pref. 236-0002 TEL 045-771-3455 FAX 045-775-0675 SOHRYU SANGYO CO., LTD Sakata Bldg. 4-2-10 Muromachi, Nihonbashi, Chuo-ku, Tokyo 103-0022 TEL 03-3279-2491 FAX 03-3245-1934 SUBARU TRADING CO., LTD Chuo No.7 Nishishinjuku Bldg. 7-18-5 Nishishinjuku, Shinjuku-ku, Tokyo 160-0023 TEL 03-3368-7321 FAX 03-3368-7377 UMITOMO ELECTRIC IIDUSTRIES, LTD 3-9-1 Shibaura, Minato-ku Tokyo 108-8539 TEL 03-6722-3525 FAX 03-6722-3527 SUZUKO CORPORATION 1-52 Hinode-cho, Naka-ku, Yokohama-city, Kanagawa Pref. 231-0066 TEL 045-231-3455 FAX 045-231-3450 TECDIA CO., LTD 20F Sunshine 60, 3-1-1 Higashi-Ikebukuro, Toshima-ku, Tokyo 170-6020TEL 03-3988-3500 FAX 03-3988-1706 TENRYU SAW MFG. CO., LTD 3711 Asaba, Fukuroi-city, Shizuoka Pref. 437-1195 TEL 0538-23-6111 FAX 0538-23-6584 TOA DIAMOND TOOLS MFG. CO., LTD 1-30-13 Nishirokugo, Ota-ku, Tokyo 144-0056 TEL 03-3738-5951 FAX 03-3738-5473 TOKYO DIAMOND TOOLS MFG. CO., LTD 2-3-5 Nakane, Meguro-ku, Tokyo 152-0031 TEL 03-3723-8111 FAX 03-3724-8573 TOMEI DIAMOND CO., LTD Davinch Akasaka Mitsuke Bldg. 3-21-20 Akasaka, Minato-ku, Tokyo 107-0052 TEL 03-3585-7981 FAX 03-3585-3282 TOYODA VAN MOPPES LTD 1-54 Shiroyama, Maiki-cho, Okazaki-city, Aichi Pref. 444-3594 TEL 0564-48-5311 FAX 0564-48-6156 TSUBOMAN COMPANY LTD 1-15-7 NikataHonmachi, Kure-city, Hiroshima Pref. 737-0152 TEL 0823-79-5135 FAX 0823-79-5137 YOKOHAMA HOUSEKI KOGU CO., LTD 1-25-3 Shin-Yokohama, Kohoku-ku, Yokohama-city, Kanagawa Pref. 222-0033 TEL 045-472-4111 FAX 045-472-4113 SUPPORTING MEMBERS DIAMOND INNOVATIONS INTERNATIONAL TOKYO OFFICE Liberty 11 Bldg. 6F 1-17-11 Nishi Shinbashi, Minato-ku Tokyo 105-0003 TEL 03-5157-8722 FAX 03-5157-8724
Dicing Blade
★
NBC-ZH Series, Electroformed Bond Blades with HUB
电镀型刀片
Application: silicon, compound semiconductor wafers (GaAs, etc), CSP and zirconium
★
NBC-Z Series, Electroformed Bond Blades
镀型刀片软刀
Application: silicon, compound semiconductor wafers (GaAs, etc), CSP and zirconium.
★
A1A/K1A Series, Metal Bond/Resin Bond Blades with Steel Core
金属结合剂
/
树脂结合剂刀片，内芯金属
Application: Various types of glass, crystals and composite materials
★
B1A Series, Metal Bond Blades
金属结合剂刀片
Application: Electronic and optical devices, semiconductor packages, ceramics, single crystal ferrite and various types of glass
★
P1A Series, Resin Bond Blades
树脂结合剂刀片
Application: Glass, crystal, quartz, semiconductor packages and ceramics Detailed Description 1) Resin bond diamond wheels: we have developed new-style resin bond diamond wheels which used successfully to precision / efficiently / low cost processing of wafer surface2) Vitrify bond diamond wheel : are successfully used to semiconductor industry and motor industry. Now we hace various series products to work in the special materials and technics with various customers Electroplate diamond wheel: electroplate grinding wheel, ideal for carbide tool's grinding, forming and sharpening.Xiamen Chiaping Diamond Industrial Co., Ltd. Place of Origin:Fujian China (Mainland)Brand Name:ChiapingModel Number:1A8, 1E8, 1M8, 1N8, 1V8Application:Diamond thin blades apply on cutting wafers, crystals, semiconductor padckages, glass, quartz, sapphire, printed board and ceramics. Features: 1. High cutting precision2. High working efficiency3. Lower heat-affected than laser4. Low balde wear5. Smooth and regular kerfBond types: Resin bond, Metal bond, Nickle bond.
库力索法半导体（苏州）有限公司
Kulicke & Soffa (Suzhou) Limited Application Engineer (Dicing Blades)
产品应用工程
(
晶圆划片
)
精密加工设备
切割机·切断机
disco Fully Automatic Dicing Saw Dicing saw Fully automatic dicing saw Fully Automatic Dicing Saw 6000 Series Details Facing dual-spindle dicing saw Max. Workpiece size Spindle pplication Layout Output DFD6240 8" Single 1.2KW (0.19N·m)1.8 kW(0.29 N·m)*2.2kW (0.70 N·m)* Silicon, various types of glass, substrates for semiconductor packages, optical devices DFD6340 Facing dual DFD6341 1.2 kW (0.19 N·m)High speed spindle* DFD6450 Parallel dual 1.0 kW (0.16 N·m)1.0 kW torque up(0.24 N·m)*2.2 kW air (0.70 N·m)* DFD6361 300 mm Facing dual 1.2 kW (0.19 N·m) DFD6362 1.2 kW (0.19 N·m)High speed spindle* DFD6760 Facing dual(Dual chuck table) (*) Optional Specification Fully Automatic Dicing Saw 600 Series Details Parallel dual-spindle dicing saw Max. Workpiece size Spindle Application Layout Output DFD641* 8" Single 1.0 kW (0.16 N·m) Silicon, Compound semiconductor wafers, various types of glass DFD651* Parallel dual DFD660* 300 mm Single DFD670* Parallel dual DFD681* 8" Single 2.2 kW (0.70 N·m) DFD691* Parallel dual (*) Discontinued Machines Automatic Dicing Saw Automatic dicing saw Automatic Dicing Saw 3000 eries Details Max. Workpiece Size Spindle Application Layout Output DAD3220 6" (6" square) Single 1.5 kW (0.48 N·m) Silicon, Compound semiconductor wafers, various types of glass DAD3230 6" square8" x 6" * DAD3430 DAD3350 8"250 mm square 1.8 kW (0.29 N·m)2.2 kW (0.70 N·m)* DAD3650 Facing dual 1.8 kW (0.29 N·m) (*) Optional pecification Automatic Dicing Saw 300 Series Details Max. Workpiece size Spindle Application Layout Output DAD321 160 x 160 mm Single 1.5 kW (0.48 N·m) Silicon, Compound semiconductor wafers, various types of glass DAD322 ø6"(6"square)*2 DAC351*1 153 x 153 mm DAD361*1 160 x 160 mm DAD381*1 304.8 x 304.8 mm 1.0 kW (0.16 N·m) (*1) Discontinued Machines(*2) A special jig is required for this function. Automatic Dicing Saw 500 Series Details Max. Workpiece size Spindle Application Layout Output DAD522* 8" Single 1.5 kW (0.48 N·m) DAD:Silicon, Compound semiconductor wafers, Thick/Hard substrates DAC:magnetic heads DAC552* 220 x 160 mm 1.0 kW (0.16 N·m) DAD562* 8" 1.5 kW (0.48 N·m) (*) Discontinued Machines tomatic Dicing Saw 600 Series Details Max. Workpiece size Spindle Application Layout Output DAD685*1 250 x 250 mm Single 1.0 kW (0.24 N·m) 2.2 kW (1.0 N·m)*2 Package Singulation DAD685*1 Parallel dual (*1) Discontinued Machines(*2) Optional Specification DISCO BLADE TYPE LIST DISCO Dicing saw chipping & blade lifetime DISCO Dicing blade
出售
DISCO
刀片
:ZH05-SD3500-N1-70-BB ZH05-SD4800-N1-70-DD ZH05-SD4000-N1-70-DDDISCO 530 BLADE NBC-CH-203J-SE-27HCAADISCO B1A BLADE
中文资料
DFD6360/6361DFD6360/6361WAFER SAW BLADE
出售
KODIS BLADE
出售
BLADE TYPE: KH4-0820 KH4-1435(
硬刀）
SAW ING
产品：
WAFER (
晶圆片）
Precision Machines Dicing and Cutting Saws Laser Saws Grinders Polishers and Dry Etchers Die Separator Surface Planer WaterJet Saw Products for New Processes Precision Processing Tools Dicing Blades Z09 Series ZH05 Series ZHCR Series ZHRF Series ZHFX Series ZHZZ Series NBC-ZH Series Z05 Series ZP07 Series NBC-Z Series B1A Series P1A Series R07 Series VT07 Series A1A/K1A Series Grinding Wheels Dry Polishing Wheels\CENTERLESS GRINDING WHEELS
、
SINTERED DIAMOND TOOLS
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RESIN BOND PRODUCTS
、
DIAMOND GRINDING DISC
、
SUPER GRINDING TOOL
、
PDC PRODUCTS
、
DIAMOND POLISHING PADS
、
SYNTHETIC DIAMONDS
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DIAMOND SEGMENTS
、
SINGLE CRYSTAL(SCD)
、
MAN MADE SUPERABRASIVE
、
C.B.N DISC
、
CUTTING DISCS
、
RESIN BONDED
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CUSTO Autech Enterprise Co.,Ltd. Autech Inc. Autech Machinery Corporation 13554801915 at 163. com autech2340
M WHEELS
、
SUPERABRASIVE PRODUCTS
、
PCD TOOLS
、
INDUSTRIAL CBN
、
VACUUM BRAZED WHEELS
切割刀片
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